- mechanical metallization
- 机械金属化
English-Chinese metallurgy dictionary. 2014.
mechanical metallization
Look at other dictionaries:
Programmable metallization cell — The programmable metallization cell, or PMC, is a new form of non volatile computer memory being developed at Arizona State University and its spinoff, Axon Technologies. PMC is one of a number of technologies that are being developed to replace… … Wikipedia
Electromigration — is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current… … Wikipedia
nanotechnology — /nan euh tek nol euh jee, nay neuh /, n. any technology on the scale of nanometers. [1987] * * * Manipulation of atoms, molecules, and materials to form structures on the scale of nanometres (billionths of a metre). These nanostructures typically … Universalium
printing — /prin ting/, n. 1. the art, process, or business of producing books, newspapers, etc., by impression from movable types, plates, etc. 2. the act of a person or thing that prints. 3. words, symbols, etc., in printed form. 4. printed material. 5.… … Universalium
MIL-STD-883 — The MIL STD 883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic environmental tests to determine resistance to… … Wikipedia
Flux (metallurgy) — Rosin used as flux for soldering A flux pen used f … Wikipedia
Eddy current — This article is about the electrical phenomenon. For the Ted McKeever comic, see Eddy Current (comics). Electromagnetism … Wikipedia
Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… … Wikipedia
Direct bonding — describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements.[1] These requirements are specified for the… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Modulating retro-reflector — A modulating retro reflector (MRR) system combines an optical retro reflector and an optical modulator to allow optical communications[1] and sometimes other functions such as programmable signage.[2] Free space optical communication technology… … Wikipedia
